Thank you for taking interest in part number 341800F00000G, an electromechanical part we have listed under the category Heat Sinks. If you are prepared to take the first step of procurement for this Boyd 341800f00000g - 76.2mm Length, 19.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. item from Boyd (Formerly Aavid), simply fill out and submit the Request for Quote (RFQ) form presented on this page. Using details that you provide, such as your desired budget, quantity, and fulfillment date, our specialists will quickly curate and present an advantageous quote for your consideration.
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